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Microfabrication Facilities
Mask aligner (MA6-BA6, Karl-Suss)
Mask aligner (MBJ3, Karl-Suss)
Spinner (Cee Model 200X)
Kurt Lesker deposition system (AXXIS deposition system, co-sputtering and E-beam evaporation)
Kurt Lesker Co-deposition sputtering system
Plasma Enhanced Chemical Vapor Deposition system (Oxford Plasmalab 800)
Reactive Ion Etcher (Oxford Plasmalab 80)
Deep Reactive Ion Etcher (Alcatel AMS-100)
Plasma Asher (Branson/IPC)
Optical microscope (Nikon Optiphot)
Profiler (P16+, KLA-Tencor)
Nanometrics nanospec (AFT 010-01)
Vapor Coater Monolayer (MVD)
Plasma CVD System (AX5200M 1.5kW MW, Seki Technotron Corporation)
Electroplating station (SEMCON 100)

Detailed Equipment List

(1) Reactive ion etcher (Oxford plasmalab 80); (2) Deep reactive ion etcher (Alcatel AMS-100); (3)Plasma enhanced chemical vapor deposition system (Oxford plasmalab 800); (4) Vapor coater monolayer (MVD); (5) Plasma asher (Branson/IPC); (6) E-Beam Evaporator/ Sputtering system (co-deposition system, Kurtlesker); (7) Sputtering system (with co-deposition capability, Kurtlesker); (8) Profiler (P16+); (9) Optical microscope (Nikon Optiphot); (10) Hotplates; (11) Electroplating station setup; (12) Dynascope stereo microscope; (13) Oven vacuum; (14) Mask aligner (MA6-BA6, Karl-Suss); (15), Mask aligner (Karl-Suss, MBJ3); (16) Spinner; (17) Atomic Force Microscope (Veeco Dektak-SXM320), (18) Nanometrics nanospec (AFT 010-01), (19) Wet bench with de-ionized water systems.

 

 

 


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